• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    SUMMARY A power conductor (1) consisting of a chain whose links are electrically conductive elements (2) (8) (9) (10) (11) (12) mounted on a sample board (3) in such a way that the elements included in the power conductor are overlappingly joined and in electrical contact with each other.
    公开号:SE1230086A1
    申请号:SE1230086
    申请日:2012-08-29
    公开日:2014-03-01
    发明作者:Jan Berglund
    申请人:Jan Berglund Med Inco Innovation Fa；
    IPC主号:
    专利说明:

    DESCRIPTION OF THE INVENTION This invention relates to a power conductor consisting of a number of electrically conductive elements which are joined to overlapping joints and are intended to be mounted on a sample board. Thereby they form a chain where each element exits a link. The chain is placed on top of a conductor and fixed to increase its cross-sectional area. The elements are with part made of copper which can be surface treated with a layer of tin or passivated father to avoid oxidation and clamed facilitate the charge. The chain with its elements is intended to be able to be automatically mounted on printed circuit boards together with other electrical components. The cards that will primarily benefit from this chain are power cards that have the task of providing other cards with tight fitting. The elements are designed so that they can be taped up on rollers to an automatic assembly machine so that they can be automatically assembled at the same time as the other components. The sample cards, or circuit boards as they are called after they are equipped with components, are usually made of epoxy laminate that has been coated with a thin layer of copper on each side. The epoxy laminates can be up to a few millimeters thick and the copper layers can be up to 100 micrometers thick. In the manufacture of printed circuit boards, a conductor sample is then etched out by etching away all the copper between the conductors, then drilling the tail as required and coating these neck cylindrical walls with copper. A problem with power cards is that if you take a thick copper layer, the conductor will be undermined. This means that its cross section is similar to a railway wheel with pits from the sides. This is partly due to the fact that it takes so long to etch away the thick copper layer, but also the fact that the edge is high means that the acid also begins to etch below the edge. For this reason, you want to avoid thick copper layers, especially for the narrower conductors because they can even be etched ay. This means that even the coarse conductors that would behave in a thick layer of copper have their conductor color forced to lower the copper thickness because the entire card is processed simultaneously.
    This is where the power conductor comes in to be mounted on the conductors that conduct high currents so that their cross-sectional area increases significantly. Since the elements are mounted overlapping, the effect is that the cross-sectional area of the copper conductor can be reduced by a factor of 20. A conductor which is 10mm wide and 50m thick and which has its thickness 1 increased by h] d1p of elements with a thickness lmm goes from 0.05mm to 1.05mm in thickness, or from 0.5 = 2 to 10.5 = 2 in cross-sectional area. The increase is in practice greater than that because the copper in the overlapping parts in principle has double the thickness.
    The fact that the elements are mounted automatically means that it is very fast and that they are positioned precisely, in addition, the process can be repeated with star precision. The sample cards are prepared before assembly by applying a layer of solder paste to the current conductor or conductors, in order to improve the soldering process. The solder paste is usually applied by screen printing, dispensing or with a kind of printer, jet printing. There are also solder pastes with a firmer viscosity that can be mounted automatically, so-called preforms (see for example Dangrong's patent US6095400 which shows a pre-reinforced variant). When the power conductor is to be mounted, you start by mounting a layer of elements in a row one after the other on a sample card conductor that has been applied with solder paste. Then mount a circular preform on top of the overlapping surface of each element to the next layer. An alternative is to trust each element to be pre-prepared with a layer of solder paste or preform on its underside, in this way you do not have to apply or mount the solder paste separately. Finally, the next layer of elements is assembled staggered so that they link the whole together into a coherent kedia. We have considered a power conductor that consists of a thin copper layer, solder paste, a thick but incremental copper layer, preforms or solder paste and finally a thick but incremental copper layer. However, since the two layers of elements overlap, the electrical and thermal effect becomes a thick conductive layer after the alum has passed through the furnace. The technique of mounting components on top of each other, so-called PoP or Package-on-Package is used, among other things, to build large memory capsules. They are mounted in several layers and loaded together by jet-printing connections on the upper side of the components (see for example Kametani's patent JP7032591) and loading together with the connections of the next layer on its underside.
    After charging, there is a thin layer of tin between the copper elements and the tin has about 8 times more conductive than copper, but since the overlapping surfaces between two elements can be dimensioned so that their area is 8 times larger than the vertical cross section of an element. it a chain without weak links. The passing electric current senses a weak but constant resistance along the length of the chain.
    The conductor below does not even have to be continuous because its cross-sectional area is only a fraction of 2 elements. This means that it works just as well if the conductor is divided into a series of short conductors that are preferably as long or slightly longer than one element. This division of the underlying conductor into smaller pieces that become electrically coherent only after the elements have been mounted also provides an opportunity for conductors of ordinary width to cross these coarse conductors. In this way, the power conductor adds another layer to the conductor sample on the circuit board.
    An alternative to solder is to use an electrically conductive glue and simply glue the elements together with each other and with the monster card. In this case, the power conductor does not even have to be placed on a conductor but can be glued directly to the card and only connected to the conductor in its lower spirits.
    The elements themselves preferably have a flat elongated body with completely rounded spirits seen from above. This design makes it possible to form a chain at all angles without any part of the element protruding beyond the underlying conductor width. Especially on the outer layer of elements in a chain, it can sometimes be good to use extra long elements. It provides an opportunity for several conductors on the card to cross under the power conductor.
    Furthermore, one can think of element variants that make it possible to branch off a gray conductor, such as a three-way crossing or a four-way crossing. The three-way intersection then resembles a triangle with rounded horns and the four-way intersection most resembles a starting plus sign with four rounded spirits.
    Another variant is that part of the element is bent up in 1800 and lies above like a roof. Choosing just 180 ° is not a chore, but the automatic assembly machines require a horizontal surface on top of components. On this bye part you can then place a connection, such as a thread, either by fitting a rivet nut or by collaring out and threading a hall in the copper plate itself. The passage should be such that it can receive a screw from above. This has created another layer of electrical connections, and this time it can be conductors of copper plate or cable connections. The connection can of course also be intended for soldering or some other clamp connection, but for large currents screw mounting is common. This is because the biasing force in the assembly is important to keep the resistance down in the transition. If the pre-voltage in a connection with large currents starts to relax, the cross-sectional area decreases markedly in the transition itself and the result can be a strong heat development that can lead to interruptions and fire. The cable connections can be both internal on the card as the copper plates just or they can also be external to connect the power from the card to the environment. The connection can also be used to mount a component such as a power diode or power transistor. Then you also get a really good cooling of that component.
    There are risks with using elements that are too thick, partly that the weight of the total power conductor can be quite large, which can cause problems during vibrations as the total energy from a vibrating power conductor can be quite large.
    Another warning flag for overly thick elements is that they require longer time and / or higher temperature in the soldering oven. It takes time to heat a solid copper body and an entire chain requires some heat for its tin layer to be remelted. There is always the risk that that time will be too long in the oven for any other component on the card that cannot withstand the heat.
    Of course, you can think of building more than just two habit elements, such as four to build a double chain. But given what has just been said about heat consumption, it probably makes more sense to build with wider elements instead, as they will then be more exposed to the ambient heat in the oven. 4 STATE OF THE ART One of the most common problems with power electronics is that components and conductor paths become heated due to strong currents. The use of wide conductors is an inexpensive way to prevent the heat from developing in a conductor. It is process-technically easy to repeat exactly over and over again, but a disadvantage is that too broad leaders take up a lot of star space. The fact that cables, plates or copper rods are used to increase capacity is both expensive and also considerably more expensive to manufacture in large series without compromising quality. One reason is that it often leads to manual work, which is expensive and not as accurate as etching processes and automatic assembly machines. Another reason is that any connection, such as a screw, contactor or the like that is to be used if you want to reinforce the conductors with plates or cables, poses a quality risk. It is usually connections that are the weakest point in electronics. Maybe because the components have become better and we have become better at handling circuit boards, for example with ESD coolers in assembly, better packaging materials and similar measures.
    The most common focus is on careful placement of components to ensure that the strong currents only need short distances. It is also important from a jamming point of view, if a circuit with high currents has a strong geographical distribution, it also means that it can large surrounding electronics because it creates strong electromagnetic fields. One way to keep these power loops together is to collect components that generate a lot of energy in power modules, such as IGBT modules. The components that make up an IGBT module are usually transistors made of silicon. In such a module, the distance is short and many parallel peasant trades are used for each connection to drive its cross-sectional area.
    If none of the above works, you can try to cool down conductors and components with, for example, forced air and cooling fins. Cooling fluids are made so that their surface against the ambient air is rigid, it can then heat up to ambient air, especially if the air has been forced up to speed with the help of a humidifier.
    To cool off, amounts of heat are usually required, water cooling is required, which is very efficient but both expensive and in many cases impractical. Then you simply have a cooler which, instead of a number of cooling fins against the surrounding air, has a number of channels in it where the water can pass and take heat from the cooler. These systems normally require some form of monitoring so that there is no leakage, corrosion and the like.
    One way to cool the conductor tracks effectively is to use IMS laminate, also called "copper-clad laminate", which is a kind of sample card that is thin and has a layer of copper on one side and a few millimeters thick integrated aluminum plate on the other . This card is mounted with the aluminum plate against a radiator, often with a heat-conducting paste between the aluminum plate and the radiator. The card effectively removes the heat generated by components and conductor paths, but has a large limitation because there is only one copper layer. The limitations mean that these cards are usually equipped with only power components and that you then have to connect to another card that has the electronic components for the logic. The connections between the cards and the fact that you use two cards increase the costs and jeopardize the quality. Having only access to one layer of copper also meant very large restrictions in the construction because it is not possible to cross conductors with the help of via halls and bearing changes. PROBLEMS SOLVED BY THE INVENTION The present invention simplifies the transport of large currents on circuit boards in a cheap and quality-assured manner. The big task of the elements will actually be to be a component whose task is to avoid the formation of heat. This is done by reducing the resistivity of the conductors by significantly increasing their cross-sectional area. This to prevent the emergence of heat is an important task because it costs a lot of money to get rid of heat created due to lack of cross-sectional area in the monster card leaders. It is also a resource problem because the heat generated in electronics is often not possible to recover but normally only gives the electrical equipment a lower efficiency. In addition to facilitating the currents to pass through the conductors and thereby reducing losses and heating, the power conductor also has the task of spreading the heat generated in the components. Copper is a very good conductor for both electric current and heat. By spreading the heat from the hottest components via the power conductor over larger areas, the cooling effect becomes much more efficient and in this way the cooled components have an increased service life.
    A further advantage of the present invention is that one can use a fairly thin copper layer on the sample card because one avoids the problem of etching as previously mentioned. This means that you can mix both power and logic on the same card without compromise when it comes to the card's storage structure. Normally, only a fatal conductor needs really thick conductors on top of a card designed solely for power supply. 7 DESCRIPTION OF THE FIGURES Figure 1 Shows a power conductor (1) consisting of a chain whose links are electrically conductive elements (2) (12) mounted on a sample board (3) Figure 2a Shows an exploded view of a power conductor in Figure 1 which also shows monster card conductor (4) with solder paste (5), individual elements (2) (12) and preforms (7) Figure 2b Shows the same exploded view as in 2a but in a perspective below showing the solder paste (6) which are pre-applied on the underside of individual elements Figure 3a Shows a power conductor that is divided into two branches Figure 3b Shows the element (8) that divides the power conductor into two parts Figure 4a Shows a power conductor that is divided into three parts Figure 4b Shows the element (9) that divides the power conductor into three parts Figure Shows a power conductor with elements (11) containing a threaded hl for electrical connection to an electrical component or a cable, an element (12) with a far-flung body and an element (10) with integrated cooling fins 8
    权利要求:
    Claims (16)
    [1]
    A power conductor (1) consisting of a chain whose links are electrically conductive elements (2) (8) (9) (10) (11) (12) mounted on a sample board (3) characterized in that the elements included in the power conductor are overlappingly joined and in electrical contact with each other
    [2]
    A power conductor containing elements made of copper in claim 1
    [3]
    A power conductor as in any of the previous requirements whose elements are intended to be able to be mounted automatically
    [4]
    A power conductor which in some of the previous requirements ddr the elements are placed on top of each other in at least two layers
    [5]
    A power conductor which in some of the preceding claims where the elements are placed on a conductor (4) on said sample card (3)
    [6]
    A power conductor which in some of the preceding claims contains elements which are surface treated in order to obtain an improved solderability
    [7]
    A power conductor which in any of the preceding claims whose elements have solder paste (5) applied in the solder joints between each other and to the underlying conductors (4) before charging
    [8]
    A power conductor which in any of the preceding claims whose elements have solder paste (6) applied to their underside before mounting
    [9]
    A power conductor which, in one of the preceding claims, is automatically soldered in the form of preforms (7) on the upwardly overlapping surfaces of the elements
    [10]
    A power conductor as in claims 1-4 with overlapping elements joined together by means of electrically conductive adhesive
    [11]
    A power conductor which in some of the previous requirements whose elements can be angled sideways said that the entire power conductor changes direction 9
    [12]
    A power conductor which in some of the preceding claims contains elements (8) which overlap with three other elements
    [13]
    A power conductor which in any of the preceding claims contains elements (9) which overlap with four other elements
    [14]
    A power conductor which in any of the preceding claims contains elements (10) having integrated cooling fins
    [15]
    A power conductor which, in any of the preceding claims, contains elements (11) having integrated devices in the form of a thread for connecting cables or connecting an electrical component
    [16]
    A power conductor which in some of the preceding claims containing elements (12) with a required body said that conductor (13) can pass below 10
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    同族专利:
    公开号 | 公开日
    US20140338964A1|2014-11-20|
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    DE1224713B|1962-09-26|1966-09-15|Kali Chemie Ag|Process for cleaning a circulating solution used for the production of hydrogen peroxide by the anthraquinone process|
    US4603927A|1984-07-12|1986-08-05|Rogers Corporation|Surface mounted bussing device|
    DE4425803A1|1993-08-11|1995-02-16|Siemens Ag Oesterreich|Printed circuit board|
    US5871325A|1995-04-19|1999-02-16|Jabil Circuit, Inc.|Thin support for PC board transfer system|
    JP3410639B2|1997-07-23|2003-05-26|株式会社日立製作所|Paste filling method, soldering method and paste printing machine|
    SE514520C2|1998-03-05|2001-03-05|Etchtech Sweden Ab|Pattern board, substrate or semiconductor tray with a conductor with etched surface structure|
    US6062903A|1998-06-08|2000-05-16|Delco Electronics Corporation|High power surface mount interconnect apparatus for electrical power control module|
    JP3846554B2|2001-06-01|2006-11-15|日本電気株式会社|Mask for printing, printing method, mounting structure, and manufacturing method of the mounting structure|
    EP1349238A1|2002-03-29|2003-10-01|STMicroelectronics N.V.|Encapsulating device and battery pack including such a device|
    DE10224713A1|2002-06-04|2003-12-18|Daimler Chrysler Ag|Repair system for flexible flat electrical cable has additional stretch of flat cable laid over gap after damaged section has been cut out with individual wire ends connected together by solder paste|
    KR100499008B1|2002-12-30|2005-07-01|삼성전기주식회사|Two-sided PCB without via hole and the manufacturing method thereof|
    JP2004228276A|2003-01-22|2004-08-12|D D K Ltd|Method of connecting connector to substrate|
    JP2006278913A|2005-03-30|2006-10-12|Toyota Motor Corp|Circuit device and manufacturing method therefor|
    DE102007038116A1|2007-07-30|2009-02-05|Gebr. Schmid Gmbh & Co.|Holding means, apparatus and method for transporting substrates, in particular printed circuit boards|
    TW200910580A|2007-08-17|2009-03-01|Hsin-Hui Yeh|CMOS image sensor package and method thereof|
    US9147649B2|2008-01-24|2015-09-29|Infineon Technologies Ag|Multi-chip module|
    JP5447124B2|2010-04-15|2014-03-19|株式会社デンソー|Mounting method and mounting device for conductive plate|
    JP2012049367A|2010-08-27|2012-03-08|Kyocera Elco Corp|Semiconductor light-emitting device attachment module, semiconductor light-emitting device module, semiconductor light-emitting device lighting apparatus, and manufacturing method of semiconductor light-emitting device attachment module|
    DE102011004526B4|2011-02-22|2021-05-06|Vitesco Technologies GmbH|Printed circuit board with high current carrying capacity and method for producing such a printed circuit board|
    US8625832B2|2011-04-04|2014-01-07|Invensense, Inc.|Packages and methods for packaging microphone devices|
    US8916968B2|2012-03-27|2014-12-23|Infineon Technologies Ag|Multichip power semiconductor device|
    TWM441261U|2012-05-18|2012-11-11|Truelight Corp|Laser diode array die structure and has the laser diode array die structure of package device|KR102059610B1|2015-12-18|2019-12-26|주식회사 엘지화학|Radiant heating system of printed circuit board using high conductance radiator pad|
    DE102017221861A1|2017-12-05|2019-06-06|Zf Friedrichshafen Ag|Printed circuit board and method for manufacturing a printed circuit board|
    法律状态:
    2019-04-02| NUG| Patent has lapsed|
    优先权:
    申请号 | 申请日 | 专利标题
    SE1230086A|SE537793C2|2012-08-29|2012-08-29|Power conductor mounted on a circuit board|SE1230086A| SE537793C2|2012-08-29|2012-08-29|Power conductor mounted on a circuit board|
    GB1400857.7A| GB2509002B|2012-08-29|2013-08-10|Power chain on a circuit board|
    PCT/SE2013/050961| WO2014035314A1|2012-08-29|2013-08-10|Power chain on a circuit board|
    EP13832479.3A| EP2891390A4|2012-08-29|2013-08-10|Power chain on a circuit board|
    US14/354,997| US9545007B2|2012-08-29|2013-08-10|Power chain on a circuit board|
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